Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Gold-on-gold stud-bumps comprise a connection technique used in some microminiature flip-chip assemblies: (a) shows bumps on an IC; (b) is a close-up view. Flip-chip processes allow miniaturization of ...

New research paper titled “Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides” by researchers at Tampere University (Finland). “The ...

Daktronics has released its Flip-Chip COB (Chip On Board) LED display technology. The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings ranging from ...

Samsung’s next-gen foldable phones are still many months away from arriving. However, early leaks have revealed an interesting detail about their potential chipsets. According to` a new report, the ...

Samsung has recently launched its flagship chipset, the Exynos 2600, which is said to be the world’s first smartphone SoC ...

Samsung is considering using the Exynos 2600 chip in the Galaxy Z Flip 8, aiming to boost AI performance, cut costs, and ...

A report out of Korea suggests Samsung will use the 2nm Exynos 2600 chip to power the upcoming Galaxy Z Flip 8.

Samsung could be planning to keep Exynos at the heart of its clamshell foldable lineup. A new report suggests the Galaxy Z Flip 8 will use the 2nm-based Exynos 2600 chip. This would follow the move ...

Summary: The Samsung Galaxy Z Flip 7 will end up utilizing the Snapdragon 8 Elite chip, it seems. The phone was tested with that chip in South Korea. It remains to be seen whether the device will be ...