The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we have been able to do thus far. But, as we were ...
Morning Overview on MSN
This Chinese challenger is coming for the memory-chip giants worldwide
China’s memory industry is no longer a distant follower. It is now fielding a pair of aggressive specialists that are ...
Tech Xplore on MSN
Ultrathin ferroelectric capacitors for next-generation memory devices
An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite ...
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