Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...

For advanced bonding schemes and panel operations, there is a high cost to discovering an interface issue late in the flow. Reliability improves when materials are specified as a system rather than as ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...

Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too ...

Engineers from the University of Newcastle have come up with a surprisingly simple new energy storage system, built around blocks that store thermal energy like melted chocolate chips in a muffin. The ...