Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...
Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...
Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
Engineers from the University of Newcastle have come up with a surprisingly simple new energy storage system, built around blocks that store thermal energy like melted chocolate chips in a muffin. The ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback