The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Thanks to an innovative extension to 3D printing, researchers can create high-performance, low-weight “unbuildable” RF structures that combine dielectrics and patterned conductors. The benefits and ...

The speed of light has come to 3D printing. Northwestern University engineers have developed a new method that uses light to improve 3D printing speed and precision while also, in combination with a ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...