Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry sources. Save my ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

Dublin, April 15, 2024 (GLOBE NEWSWIRE) -- The "Global Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Global IC Packaging Materials Market research reveals growth projections, industry demand, and investment opportunities through 2031. The U.S. semiconductor packaging materials market is growing with ...

CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...